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High Removal Rate Poly Diamond Slurry For Polishing Sapphire Wafer

High Removal Rate Poly Diamond Slurry For Polishing Sapphire Wafer

  • High Removal Rate Poly Diamond Slurry For Polishing Sapphire Wafer
  • High Removal Rate Poly Diamond Slurry For Polishing Sapphire Wafer
High Removal Rate Poly Diamond Slurry For Polishing Sapphire Wafer
Produktdetails:
Herkunftsort: Shanghai
Markenname: SIGNI
Zertifizierung: ISO
Modellnummer: PYML
Zahlung und Versand AGB:
Min Bestellmenge: 1L
Verpackung Informationen: Karton
Zahlungsbedingungen: T/T, L/C, PAYPAL, WESTverband
Kontakt
Ausführliche Produkt-Beschreibung
Material: Diamant Anwendung: Politur Edelstahl
Marke: SIGNI
Markieren:

3μm Diamond Slurry Polishing

,

PYML Diamond Slurry Polishing

,

3μm glass edge polishing

  • High Removal Rate Poly Diamond Slurry for Polishing Sapphire Wafer

     

    1. Poly diamond slurry/suspension with high removal rate, high selectivity, low damage and high cleaning characteristic
    2. Poly diamond slurry/suspension manufacturer for ten years

    3. Certificates: ISO 9001:2008, ISO 14001; OHSAS18001

     

    High Removal Rate Poly Diamond Slurry For Polishing Sapphire Wafer 0

     

    Our diamond slurries are made with diamond particles completely dispersed in the mixed liquids. 3 series according to the constituents:

     

    Monocrystaline Diamond Slurry(MDS): Good removal effects, suitable for lapping & polishing of hard material.
    Polycrystaline Diamond Slurry(PDS): Superb tenacity & self-sharpening features. Suitable for lapping and polishing of precision metal material, optical crystals, ceramics and hard materials.
    Nano Diamond Slurry(NDS): Good dispersing stability & suitable for precise surface treatment.

    Sizes Available
     

    Size
    Medium
    MDS
    PDS
    NDS
    Size
    Medium
    MDS
    PDS
    NDS
    0.05
    Water/Oil
    1-3
    Water/Oil
       
    0.08
    Water/Oil
    2-4
    Water/Oil
     
    0.1
    Water/Oil
    3-6
    Water/Oil
       
    0.15
    Water/Oil
    4-8
    Water/Oil
     
    0.2
    Water/Oil
    5-10
    Water/Oil
       
    0.25
    Water/Oil
    6-12
    Water/Oil
     
    0.5
    Water/Oil
    8-16
    Water/Oil
       
    0-1
    Water/Oil
     
    10-20
    Water/Oil
       
    0.5-1
    Water/Oil
     
    15-25
    Water/Oil
       
    0-2
    Water/Oil
     
    20-30
    Water/Oil
       
    1-2
    Water/Oil
       
    30-40
    Water/Oil
       



    Main products: Monocrystal, Poly and Nano diamond and their powders' series, CBN powder, slurry and polishing films. Our products can meet and surpass international standard and enjoy a high appraisal from customers from the USA, Europe, Korea, Japan and Taiwan area.

    Our company is proud of a strong professional managerial and R&D team. Relying on ISO9000/14000 and OHSAS18000 systems, we exert every effort to uplift our product quality, improve our services and provide new varieties of products to the win-win goal with our customers for sustainable development.

     

     

     

    High Removal Rate Poly Diamond Slurry for Polishing Sapphire Wafer

     
     
     
    Details

  Characteristics:

  ★ Fine polycrystalline diamond materials.

  ★ Superhigh cutting force and surface finish in the processing of high hardness wafers.

  ★ Different carriers are suitable for different fields.

  Available Sizes:

Size(μm)
0.25
0.5
1
3
4
6
Media
Water/Oil
Water/Oil
Water/Oil
Water/Oil
Water/Oil
Water/Oil

Remarks: Special sizes can be tailor-made.

  Applications:

  1.Semiconductor wafer processing: such as sapphire substrate, SiC wafer and sapphire window film.

  2.Ceramic processing: such as Zirconia fingerprint identification chip, Zirconia ceramic mobile phone back cover and other functional ceramics.

  3. Metal processing: such as stainless steel, die steel, aluminum alloy and other metal materials.

High Removal Rate Poly Diamond Slurry For Polishing Sapphire Wafer 2

Kontaktdaten
SIGNI INDUSTRIAL (SHANGHAI) CO., LTD

Ansprechpartner: Zhao

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